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ZXGD3004E6 8A(peak) gate driver in SOT23-6
General description
The ZXGD3004E6 is a high-speed non-inverting single MOSFET gate driver capable of driving up to 8A into a MOSFET or IGBT gate capacitive load from supply voltages up to 40V. With typical propagation delay times down to ~1ns and rise/fall times down to 14ns this device ensures rapid switching of the power MOSFET or IGBT to minimize power losses and distortion in high current fast switching applications. The ZXGD3004E6 is inherently rugged to latch-up and shoot-through, and its wide supply voltage range allows full enhancement to minimize on-losses of the power MOSFET or IGBT. Its low input voltage requirement and high current gain allows high current driving from low voltage controller ICs, and the optimized pin-out SOT23-6 package with separate source and sink pins eases board layout, enabling reduced parasitic inductance and independent control of rise and fall slew rates.
Features
* * * 40V operating voltage range 8 amps peak output current Fast switching emitter-follower configuration * 1ns propagation delay time * 14ns rise/fall time, 1500pF load Low input current requirement * 1.9A(source)/1.9A(sink) output current from 10mA input SOT23-6 package Separate source and sink outputs for independent control of rise and fall time Optimized pin-out to ease board layout and minimize trace inductance No Latch Up No shoot through Near - Zero quiescent and output leakage current
* * * * * * *
Typical application circuit
VS
VCC
VCC IN1 SOURCE
Input
IN2
ZXGD3004
SINK
GND
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ZXGD3004E6
Applications
Power MOSFET and IGBT Gate Driving in * * * * * Synchronous switch-mode power supplies Secondary side synchronous rectification Plasma Display Panel power modules 1, 2 and 3-phase motor control circuits Audio switching amplifier power output stages
Pin configuration
VCC IN1 GND SOT236 Top view SOURCE IN2 SINK
Pin description
Pin Name VCC IN1 / IN2 GND SOURCE SINK Pin Function Driver supply. Driver input pins. These are normally connected together by circuit tracks. Ground. Source current output. Sink current output.
Ordering information
Device ZXGD3004E6TA Reel size (inches) 7 Tape width (mm) 8 embossed Quantity per reel 3000
Device marking
3004
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ZXGD3004E6
Absolute maximum ratings
Parameter Supply voltage Input voltage Peak sink current(c) Source current @ IIN1 + IIN2 =10mA(a) Sink current @ IIN1 + IIN2 =10mA(a) Input current(c) Power dissipation at TA =25C(a)(b) Linear derating factor Operating and storage temperature range Tj, Tstg Symbol VCC VIN I(sink)PK I(source) I(sink) IIN1, IIN2 PD Limit 40 40 8 1.9 1.9 1 1.1 8.8 -55 to +150 Unit V V A A A A W mW/C C
Thermal resistance
Parameter Junction to ambient(a)(b) Symbol R JC Value 113 Unit C/W
NOTES: (a) For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) For device with two active dice running at equal power. (c) Pulse width <=300us limit repetition rate to comply with maximum junction temperature.
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ZXGD3004E6
Electrical characteristics (at Tamb = 25C unless otherwise stated).
Parameter Output voltage, high Output voltage, low Symbol VOH VOL Min. Typ. VIN1 - 0.4 VIN1 + 0.4 1 1 50 1.2 1.2 1.9 1.9 8 8 1.1 13.4 0.95 12.4 3.2 77.9 3.6 82 Max. Unit V V A A nA A A A A ns ns ns ns ns ns ns ns Conditions Isource = 1 A Isink = 1 A VCC = 40V, VIN1 = VIN2 = 0V VCC = 40V, VIN1 = VIN2 = VCC VCC = 32V, VIN1 = VIN2 = 0V IIN1+IIN2 = 10mA IIN1+IIN2 = 10mA IIN1+IIN2 = 1A IIN1+IIN2 = 1A CL=1.5nF, RL=0.1 , VCC=15V, VIN=12.5V, RS=25 CL=1.5nF, RL=0.1 , VCC=15V, VIN=12.5V, RS=1k
Source output leakage IL(source) current Sink output leakage current Quiescent current IL(sink) IQ
Source output current I(source) Sink output current I(sink) I(sink)PK td(rise) tr td(fall) tf td(rise) tr td(fall) tf Source output current I(source)PK Sink output current Gate driver switching times
Gate driver switching times
Switching time test circuits
Timing diagram
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ZXGD3004E6
Typical gate driver characteristics
100
TA = 25C VCC= 15V VIN = 12.5V
Fall Time
TA = 25C
10
VCC= 15V VIN = 12.5V RS = 25 RL = 0.1
Delay Rising
Time (ns)
RS = 25 RL = 0.1
Rise Time
Time (ns)
Delay Falling
10
1
0.1
1
10
100
0.1
1
10
100
CL Capacitive Load (nF)
CL Capacitive Load (nF)
Rise and Fall Time
Peak Drive Current (A)
T A = 25C VCC= 15V VIN = 12.5V RS = 25 RL = 0.1 Rising Falling
Propagation Delay
100 Duty Cycle = 50%
5 4 3 2 1
Supply Current (mA)
6
10
250KHz TA = 25C VCC= 15V
1
100KHz
VIN = 12.5V RS = 25 RL = 0.1
0 100m
1
10
100
0.1 0.1
1
10
100
CL Capacitive Load (nF)
CL Capacitive Load (nF)
Peak Drive Current
16
VIN T A = 25C VCC = 15V VIN = 12.5V
Supply Current
16
VIN T A = 25C VCC = 15V VIN = 12.5V RS = 1000 CL = 1.5nF RL = 0.1
12 Voltage (V) 8 4
12 Voltage (V) 8 4 0
RS = 25 CL = 1.5nF RL = 0.1 VOUT
VOUT
0 0 100 200 300 400 500 600 700 800
0
200
400
600
800
1000
Time (ns)
Time (ns) Switching Speed
Switching Speed
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ZXGD3004E6
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ZXGD3004E6
SOT23-6 Package outline
0.95 0.037 1.06 0.042 2.2 0.087
0.65 0.026
DIM A A1 A2 b C D E E1 L e e1 L Min. 0.90 0.00 0.90 0.35 0.09 2.70 2.20 1.30 0.10 0.95 REF 1.90 REF 0 30 0 Millimeters Max. 1.45 0.15 1.30 0.50 0.26 3.10 3.20 1.80 0.60 Min. 0.0354 0.00 0.0354 0.0078 0.0035 0.1062 0.0866 0.0511 0.0039 0.0374 REF 0.0748 REF Inches
mm inches
Max. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 0.1181 0.0708 0.0236
30
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
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ZXGD3004E6
Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user's application and meets with the user's requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex' terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: "Preview" Future device intended for production at some point. Samples may be available "Active" Product status recommended for new designs "Last time buy (LTB)" Device will be discontinued and last time buy period and delivery is in effect "Not recommended for new designs" Device is still in production to support existing designs and production "Obsolete" Production has been discontinued Datasheet status key: "Draft version" This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. "Provisional version" This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. "Issue" This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstrae 59 D-81541 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
(c) 2007 Published by Zetex Semiconductors plc
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